Instead of organic materials, Intel wants to use glass as a carrier material in chip housings in a few years. This should enable even larger chips with even more individual chiplets and more connections per square millimeter in between.
More and more processors no longer consist of just a single, “monolithic” piece of silicon (Die), but are composed of several of them. They sit together on a special circuit board with many layers and extremely densely packed conductor tracks, the die carrier. The demands on this chip carrier are constantly increasing because the number of chips and the connections between them and the CPU socket continue to grow.
Electrical and mechanical advantages
In addition, the substrate of the die carrier may only expand slightly when it heats up and cools down, otherwise strong (shear) forces will arise that place mechanical stress on the electrical connections and destroy them in the long term. Glass behaves very similarly to crystalline silicon, which the wafers or dies or chiplets are made of.
Image 1 of 5
Approximately every 15 years there are significant advances in chip packaging, i.e. in the technology used to package semiconductor components.
According to Intel, it has already invested more than a billion US dollars in the development of a packaging process for chiplets (also called tiles) on glass substrates. In principle, these glass supports are also suitable for transmitting light signals from optical (CPU) interfaces, which Intel is also working on, for example together with Ayar Labs.
Intel also highlights that glass has significantly smoother surfaces compared to organic substrates made from resin-soaked glass fabric. This allows finer structures to be created, for example more through-holes per square millimeter (Through Glass Vias, TGV).
Intel continues to insulate additional layers of cables above and below the glass core with organic films such as Ajinomoto Buildup Film (ABF) aka “sushi film”.
Inter is hosting “Intel Innovation 2023” on September 19th and 20th, 2023 in San Jose, California, and will be providing insights into future products. This year, chips and software for AI will play an essential role.
The c’t podcast bit noise about chip packaging:
To the home page
#Intel #packing #future #giant #chips #glass #carriers