New memory chips increase the maximum capacity from 24 to 32 gigabits. This allows manufacturers to create larger modules. Samsung is initially focusing on servers and is talking about exotic RDIMMs with a capacity of up to 1 TB. Meanwhile, 64 GB bars could appear for desktop PCs and notebooks.
32 Gbit components already existed within the DDR4 generation, but only as a stack consisting of two individual chips. In the case of Samsung’s new DDR5 announcement, these are monolithic chips with manufacturing technology from the current 12 nanometer class. Such class specifications are common for memory – the manufacturing technology differs significantly from that for logic chips such as processors.
16 such chips on a DDR5 bar equipped on both sides result in a capacity of 64 GB. The current maximum is 48 GB with “crooked” 24 Gbit chips that have been available for a few months. Bars with capacities of 16 and 32 GB are more common.
Theoretically 1 TByte possible
Samsung does not directly produce 1 TByte RDIMMs, but the new chips would pave the way to such: To do this, the manufacturer would have to solder 40 components, each stacking eight of the new chips. Samsung announced 512 GB RDIMMs in this design at the beginning of 2021, but they are not yet available.
In the case of RDIMMs with a capacity of 128 GB, Samsung calculates that the new chips work around 10 percent more efficiently than previous stacked solutions.
Samsung wants to start series production of the 32 Gbit chips by the end of the year. Micron announced in July that it would mass produce its 32 Gbit chips starting in the first half of 2024.
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